Madhavan Swaminathan has been recognized with the 2024 Rao R. Tummala Electronics Packaging Technology Award.

Swaminathan is professor emeritus in the Georgia Tech School for Electrical and Computer Engineering (ECE) and the current department head of electrical engineering in the Penn State School of Electrical Engineering and Computer Science (EECS).

For 28 years, Swaminathan dedicated his career to Georgia Tech, becoming the director of the 3D Systems Packaging Research Center (PRC) in 2019. The establishment of the PRC was led by Rao Tummala, the namesake of the Electronics Packaging Technology Award, and also professor emeritus in ECE. Swaminathan played a pivotal role in the advancement of the PRC while at Georgia Tech.

The award is one of IEEE’s Technical Field Awards (TFAs) which represents the highest award given by each IEEE Society, bestowed for contributions or leadership in specific fields of interest of IEEE.

The distinguished award, sponsored by the IEEE Electronics Packaging Society and Friends of Rao R. Tummala, acknowledges Swaminathan’s, “exceptional contributions to semiconductor packaging and system integration technologies, which have significantly improved electronic system performance, efficiency, and capabilities.”

In 2023, Swaminathan joined the Penn State faculty as the William E. Leonhard Endowed Chair. He also serves as the director of the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES), supported through Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0).

Tummala was the Joseph M. Pettit Chair in Electronics Packaging in ECE from 1993 to 2019. As the founding director of PRC, he pioneered the Second Law of Electronics, propelling the industry forward with his visionary System-On-Package (SOP) concept. His contributions were further recognized with the distinguished title of Georgia Research Alliance Eminent Scholar from 1993 to 2019.

Top photo: Madhavan Swaminathan (left) and Rao R. Tummala (right).