The use of AI in EDA is a hot topic due to significant progress with applying machine learning to the issues of chip design.

ECE Ph.D. student Hakki Mert Torun received the Best Student Paper Award at the IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems, held October 14-17 in San Jose, California.

Georgia Tech’s Center for Co-design of Chip, Package System (C3PS) led by Profs. A. Raychowdhury and M. Swaminathan headed-up Georgia Tech’s winning proposal that resulted in a 5 year, $3.5M award that will fund up to 10 GRA positions.

“This paper presents the first reported integrated circuit which implements reinforcement learning at less than a milli-Watt. This can enable a wide variety of applications in autonomous and bio-mimetic systems.”

Swaminathan is an internationally recognized researcher in microelectronic packaging.

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages, and systems.

Georgia Tech serves as a vital partner in training the microelectronics workforce, driving future microelectronics advances, and providing unique fabrication and packaging facilities to develop and test new solutions.

ECE Ph.D. student Venkatesh Avula won the Best Overall Poster Award at ITherm 2021.

Traditionally, electric components and systems, such as semiconductors and chips, are tuned and tested over months before they are optimized for a task. A new method uses a statistical technique based on probabilities called Bayesian optimization.

Osama Waqar Bhatti and Madhavan Swaminathan received the Best Paper Award at the International Symposium on Quality Electronic Design (ISQED’21), which took place April 7-9 in a virtual format. 

Jinwoo Kim and a team of researchers from the Georgia Tech School of Electrical and Computer Engineering (ECE) won a best paper award at the 38th IEEE International Conference on Computer Design. 

Following an international search, Madhavan Swaminathan has been appointed as the new director of Georgia Tech’s 3D Systems Packaging Research Center (PRC).

Professor Emeritus Madhavan Swaminathan’s contributions to semiconductor packaging have been recognized with an IEEE Technical Field Award named in honor of Professor Emeritus Rao R. Tummala.