Georgia Tech Ph.D. student Shreya Dwarakanath won the Best of Track (Advanced Packaging) & Best Student Paper awards at the 49th International Symposium on Microelectronics (IMAPS), held October 10-13, 2016 in Pasadena, California.
Georgia Tech and its industry partners demonstrate pioneering advances in 3D Glass-based RF modules and Integrated Passive Devices (3D IPDs) as the next stage of evolution.
The Georgia Institute of Technology, School of Electrical and Computer Engineering Professor, Dr. Rao Tummala, will present a keynote lecture at the 2016 International Wafer-Level Packaging Conference (IWLPC), on October 19 in San Jose, CA.
Rao Tummala, a professor emeritus in the Georgia Tech School of Electrical and Computer Engineering (ECE), has been honored with having an IEEE Technical Field Award named in his honor – the IEEE Rao Tummala Electronics Packaging Award.
ECE Ph.D. student Muhammad Ali won the Intel Best Student Paper Award at the IEEE 68th Electronic Components and Technology Conference (ECTC), held May 29-June 1, 2018, in San Diego, California.
ECE Ph.D. student Siddharth Ravichandran won the Best Student Paper Award at the 51st International Symposium on Microelectronics (IMAPS), held October 9-11, 2018 in Pasadena, California.
ECE Ph.D. student Atom Watanabe won the ICEP 2018 IEEE CPMT Japan Chapter Young Award at the 2018 International Conference on Electronics Packaging (ICEP), held April 17-21 in Mie, Japan.
Following an international search, Madhavan Swaminathan has been appointed as the new director of Georgia Tech’s 3D Systems Packaging Research Center (PRC).
Professor Emeritus Madhavan Swaminathan’s contributions to semiconductor packaging have been recognized with an IEEE Technical Field Award named in honor of Professor Emeritus Rao R. Tummala.
