Ninad Shahane received the Best Interactive Presentation Award at the 2016 IEEE Electronic Components and Technology Conference (ECTC), held May 31-June 3 in Las Vegas, Nevada.
Hanju Oh and Dibyajat Mishra shared the first place poster award at the IEEE Global Interposer Technology Conference, held November 5-7 at the Georgia Tech Global Learning Center.
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages, and systems.
Georgia Tech serves as a vital partner in training the microelectronics workforce, driving future microelectronics advances, and providing unique fabrication and packaging facilities to develop and test new solutions.
Traditionally, electric components and systems, such as semiconductors and chips, are tuned and tested over months before they are optimized for a task. A new method uses a statistical technique based on probabilities called Bayesian optimization.
Osama Waqar Bhatti and Madhavan Swaminathan received the Best Paper Award at the International Symposium on Quality Electronic Design (ISQED’21), which took place April 7-9 in a virtual format.
ECE Ph.D. student Muhammad Ali won the Intel Best Student Paper Award at the IEEE 68th Electronic Components and Technology Conference (ECTC), held May 29-June 1, 2018, in San Diego, California.
ECE Ph.D. student Siddharth Ravichandran won the Best Student Paper Award at the 51st International Symposium on Microelectronics (IMAPS), held October 9-11, 2018 in Pasadena, California.
Following an international search, Madhavan Swaminathan has been appointed as the new director of Georgia Tech’s 3D Systems Packaging Research Center (PRC).
Professor Emeritus Madhavan Swaminathan’s contributions to semiconductor packaging have been recognized with an IEEE Technical Field Award named in honor of Professor Emeritus Rao R. Tummala.
