Rao Tummala will receive the 2011 IEEE Components, Packaging, and Manufacturing Technology (CPMT) Award "for pioneering and innovative contributions to package integration research, cross-disciplinary education, and globalization of electronic packaging."

This award recognizes lifelong contributions to industry, academia, and professional societies in components, packaging, and manufacturing technologies. Dr. Tummala will receive this honor at the IEEE 61st Electronic Components and Technology Conference, to be held next spring in Lake Buena Vista, Fla.

Dr. Tummala has been on the faculty of the School of Electrical and Computer Engineering at Georgia Tech since 1993. He is the director of the Packaging Research Center and holds the Joseph M. Pettit Chair in Packaging. He is also a Georgia Research Alliance Eminent Scholar.