Rao Tummala was presented with the 2011 TechnoVisionary Award from the India Semiconductor Association (ISA) on February 21 at the ISA Vision Summit, held in Bangalore, India.

This award honors individuals who make outstanding contributions to the semiconductor and electronics fields in academics, research, industry, or public service. Dr. Tummala was recognized for his lifetime achievements in microelectronics packaging research and education both at IBM and as the director of the 3D Systems Packaging Research Center at Georgia Tech, as well as for his leadership of the IEEE Components, Packaging, and Manufacturing Technology Society.

Dr. Tummala has been a faculty member in the School of Electrical and Computer Engineering since 1993, where he holds the Joseph M. Pettit Chair in Electronics Packaging and is a Georgia Research Alliance Eminent Scholar.