Muhannad S. Bakir has been named the recipient of the 2018 IEEE Electronics Packaging Society (EPS) Exceptional Technical Achievement Award. He is a professor in the Georgia Tech School of Electrical and Computer Engineering (ECE).

Bakir is being recognized "for contributions to 2.5D and 3D IC heterogeneous integration, with focus on interconnect technologies." He will be presented with this award on May 31 at the IEEE Electronic Components Technology Conference, to be held in San Diego, California.

This honor recognizes exceptional contributions to the field, including a significant invention, a new and important technology or product, or work that advances the state-of-the-art in the IEEE EPS' fields of interest. The contributions must be documented by open literature publications.

Bakir has been a member of the ECE academic faculty since 2010, where he leads the Integrated 3D Systems Lab. He is a co-recipient of the 2017 Georgia Tech Outstanding Achievement in Research Program Development Award, and he serves as a Distinguished Lecturer for the IEEE EPS. 

Bakir is the recipient of the 2013 Intel Early Career Faculty Honor Award, 2012 DARPA Young Faculty Award, and 2011 IEEE EPS (formerly CPMT) Society Outstanding Young Engineer Award. He was an invited participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium.

Bakir serves on the editorial board of the IEEE Transactions on Components, Packaging and Manufacturing Technology (TCPMT) and the IEEE Transactions on Electron Devices (TED).