ECE Courses by TIG

Course NumberCourse Title and Catalog Description

ECE6453

Theory of Electronic Devices

Presents the fundamentals of electronic device operation

ECE6779

Thermal Engineering for Packaging of Micro and Nano Systems

Passive, active, and hybrid thermal management techniques, and computational modeling of micro systems. Air cooling, simlge phase and phase change liquid cooling, heat pipes, and thermoelectrics. Crosslisted with ME 6779.

ECE3040

Microelectronic Circuits

Basic concepts of microelectronic materials, devices and circuits.

ECE6759

Plasma Processing of Electronic Materials and Devices

Fundamental physics, chemistry, chemical engineering and electrical engineering principles inherent in plasma processes. Includes etching, deposition, diagnostic methods, and control schemes. Cross-listed with CHE 6759.

ECE4451

Semiconductor Devices for Wireless & Fiber Communication

Advanced development of semiconductor device theory focusing on optoelectronic emitters, detectors, & high frequency transistors to provide an understanding of devices used in communications systems

ECE3043

Measurements, Circuits and Microelectronics Laboratory

Basic electronic test instrumentation. Elementary passive and active circuits using both discrete (diodes, bipolar junction transistors, MOSFETs) and integrated devices (operational amplifiers).

ECE6444

Silicon-Based Heterostructure Devices and Circuits

Theory and design of novel silicon-germanium microelectronic devices and circuits. Materials, device physics, fabrication, measurement, circuit design, and system applications.

ECE6455

Semiconductor Process Control

This course is designed to explore methods of applying statistical process control and statistical quality control to semiconductor manufacturing processes. Students will be required to complete a design project.

ECE6450

Introduction to Microelectronics Technology

Presents the fundamentals of microelectronics material, device, and circuit fabrication

ECE3450

Semiconductor Devices

Properties of semiconductor devices. Applications in current and future computers, fiber optic and wireless communication systems. Future needs of high frequency, GHz-range, device operation.

ECE4755

Electronic Packaging Substrate Fabrication

This course provides hands-on instruction in basic packaging substrate fabrication techniques, including interconnect design and testing, dielectric deposition, via formation, and metallization. Crosslisted with CHE 4755.

ECE6776

Integrated and Low-Cost Microelectronics Systems Packaging

Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-on-chip and system-on-package. Crosslisted with ME and MSE 6776.

ECE4460

Introduction to Electronic Systems Packaging

Introduction to packaging technologies, technology drivers, electrical performance, thermal management, materials, optoelectronics, RF integration, reliability, system issues, assembly, and testing.

ECE4452

Integrated Circuit Fabrication

Introduction to microelectronic processing technologies and CMOS. Includes a laboratory for fabrication/testing of MOS transistors, basic CMOS circuits, integrated resistors and capacitors.

ECE6456

Solar Cells

To provide a practical understanding of semiconductor materials and technology as it relates to design and development of efficient solar cells and photovoltaic systems.

ECE6542

Optoelectronics: Devices, Integration, Packaging, Systems

Optoelectronic devices (detectors, emitters, modulators) from the practical realized and theoretical performance perspective. Explores monolithic and hybrid integration of devices, packaging and system implementation.

ECE6771

Optoelectronics: Materials, Processes, Devices

Optoelectronic materials, physical processes, and devices. Includes compound semiconductor materials, excitation, recombination, gain, and modulation processes and devices such as emitters, detectors, and modulators. Crosslisted with PHYS 6771.

ECE4754

Electronics Packaging Assembly, Reliability, Thermal Management, and Test

The course provides hands-on instruction in electronics packaging, including assembly, reliability, thermal management, and test of next-generation microsystems. Crosslisted with ME and MSE 4754.

ECE4752

Integrated Circuit Fabrication

The objective of this course is to give students exposure to the various steps involved in the fabrication of integrated circuits and devices. 'The course will include a laboratory segment in which students fabricate MOS transistors, diffused resistors and MOS capacitors from a bare silicon substrate. Crosslisted with CHE 4752.

ECE6451

Introduction to the Theory of Microelectronics

Basis of quantum mechanics, statistical mechanics, and the behavior of solids to serve as an introduction to the modern study of semiconductors and semiconductor devices.

ECE6458

Gigascale Integration

Hierarchy of physical principles that enable understanding and estimation of future opportunities to achieve multibillion transistor silicon chips using sub-0.25 micron technology.

ECE6460

Microelectromechanical Devices

Fundamental concepts for design of microelectromechanical devices (MEMS), including mechanical and thermal behavior of materials and structures, transduction principles, transducer design, and modeling.

ECE6229

Introduction to MEMS

Introduction to Micro-Electro-Mechanical systems: Microfabrication techniques including: photolithography, etching, physical and chemical vapor deposition, electroplating, bonding and polymer processing. Application to sensors and actuators. Credit not allowed for both ECE 6229 and ME 6229 or CHBE 6229.
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