The use of AI in EDA is a hot topic due to significant progress with applying machine learning to the issues of chip design.

Georgia Tech and NextFlex – Flexible Hybrid Electronics Manufacturing Innovation Institute hosted a workshop to explore energy harvesting, energy storage, and power deliver & management approaches for Internet of Things.

On May 22nd and 23rd, 2017, IEN hosted its first annual “Technical Exchange Conference” to bring together academic and industry engineers working on global issues using interdisciplinary approaches.

In their recent work published as an Editor’s Pick in the May issue of Applied Physics Letters, they show how these mystery materials—antiferroelectrics—can be fine-tuned by doping...

On October the 24th, sophomore level students from the Gwinnett School of Mathematics, Science, and Technology (GSMST) got the rare chance to “gown up” and enter the research cleanrooms at the Marcus Nanotechnology Building.

Georgia Tech’s Center for Co-design of Chip, Package System (C3PS) led by Profs. A. Raychowdhury and M. Swaminathan headed-up Georgia Tech’s winning proposal that resulted in a 5 year, $3.5M award that will fund up to 10 GRA positions.

New methods of communication, which can reach anyone in the world, effectively for free, spurred Dr. Michael Filler to launch the Nanovation podcast.

The Center for Advanced Electronics through Machine Learning (CAEML) seeks to accelerate advances by leveraging machine-learning techniques to develop new models for electronic design automation (EDA) tools create and verify chip designs for market.