As part of the CHIPS National Advanced Packaging Manufacturing Program (NAPMP), three advanced packaging research projects will receive investments of up to $100 million each. This work will accelerate the development of cutting-edge substrate and materials technologies essential to the semiconductor industry.  

NAPMP was developed to support a robust U.S. ecosystem for advanced packaging, which is key to every electronic system. NAPMP will enable leading-edge research and development, domestic manufacturing facilities, and robust training and workforce development programs in advanced packaging.  

In partnership with Georgia Tech and the 3D Packaging Research Center (PRC), Absolics will receive $100 million to develop revolutionary glass core substrate panel manufacturing. 

“This landmark investment in Absolics is also a transformational investment in Georgia Tech,” said Tim Lieuwen, interim executive vice president for Research. “It will redefine the possibilities of our longstanding partnership by expanding Georgia Tech’s expertise in electronic packaging, which is vital to the semiconductor supply chain. This federal funding uniquely positions us to merge cutting-edge research with industry, drive economic development in Georgia, and create a workforce ready to tackle tomorrow’s manufacturing demands.” 

Georgia Tech has a long history of pioneering packaging research. Through a previous collaboration with the PRC, Absolics has already invested in the state of Georgia by building a glass core substrate panel manufacturing facility in Covington.  

Georgia Tech’s Institute for Matter and Systems (IMS), home to the PRC, houses specialized core facilities with the capabilities for semiconductor advanced packaging research and development. 

“Awards like this reinforce the importance of collaborative research between research disciplines and the private and public sector. Without the research and administrative support provided by IMS and the Georgia Tech Office of Research Development, projects like this would not be coming to Georgia Tech.” said Eric Vogel, IMS executive director. 

 Georgia Tech is a leader in advanced packaging research and has been working on glass substrate packaging research and development for years. Through this new Substrate and Materials Advanced Research and Technology (SMART) Packaging Program, Absolics aims to build a glass-core packaging ecosystem. In collaboration with Absolics, Georgia Tech will receive money for research and development for a glass-core substrate research center.  

“We are delighted to partner with Absolics and the broader team on this new NAPMP program focused on glass-core packaging,” said Muhannad Bakir, Dan Fielder Professor in the School of Electrical and Computer Engineering and PRC director. “Georgia Tech’s role will span program leadership, research and development of novel glass-core packages, technology transition, and workforce development.” Bakir will serve as the associate director of SMART Packaging Program, overseeing research and workforce development activities while also leading several research tasks.  

 "This project will advance large-area glass panel processing with innovative contributions to materials and processing, modeling and simulation, metrology and characterization, and testing and reliability. We are pleased to partner with Absolics in advancing these important technology areas," said Regents' Professor Suresh K. Sitaraman of the George W. Woodruff School of Mechanical Engineering and the PRC. In addition to technical contributions, Sitaraman will direct the new SMART Packaging Program steering committee.  

 “The NAPMP Materials and Substrates R&D award for glass substrates marks the culmination of extensive efforts spearheaded by Georgia Tech’s Packaging Research Center,” noted George White, senior director of strategic partnerships and the theme leader for education and workforce development in the SMART Packaging Program. “This recognition highlights the state of Georgia’s leadership in advanced substrate technology and paves the way for developing the next generation of talent in glass-based packaging.”  

 The program will support education and workforce development efforts by bringing training, internships, and certificate opportunities to technical colleges, the HBCU CHIPS Network, and veterans' programs.