Introduction to MEMS
(2-0-0-3)
CMPE Degree: This course is Not Applicable for the CMPE degree.
EE Degree: This course is Not Applicable for the EE degree.
Lab Hours: 0 supervised lab hours and 0 unsupervised lab hours.
Technical Interest Group(s) / Course Type(s): Cross-listed courses, Nanotechnology
Course Coordinator:
Prerequisites: None.
Catalog Description
Introduction to Micro-Electro-Mechanical systems: Microfabrication techniques including: photolithography, etching, physical and chemical vapor deposition, electroplating, bonding and polymer processing. Application to sensors and actuators. Credit not allowed for both ECE 6229 and ME 6229 or CHBE 6229.Textbook(s)
Micromachined Transducers Sourcebook, Microsystem Design, Fundamentals of MicrofabricationCourse Outcomes
Not Applicable
Strategic Performance Indicators (SPIs)
Not Applicable
Topical Outline
1. LECTURE TOPICS
a) Introduction and scaling laws
b) Introduction to lithography
c) Mask aligner and imaging optics
d) Resolution in photolithography and mask layout
e) Structure of silicon and properties
f) Oxidation and diffusion
g) Nucleation and growth
h) Evaporation and Sputtering
i) CVD and PECVD
j) Atomic Layer Deposition
k) Polysilicon
l) Wet etching
m) Surface micromachining
n) Bulk micromachining processes
o) Corner compensation and etch stop
p) Vacuum physics and kinetic theory
q) Plasma and Deep RIE etching
r) Characterization Methods
s) PDMS and SU-8 MEMS processing
t) Stereolithography
u) Wafer anodic bonding and local bonding
v) Electroplating metals
w) MEMS/NEMS Sensors
x) Microcantilever Fabrication Processes
2. LABORATORY EXPERIMENTS
a) Lab safety and clean room protocol
b) CAD and Mask Making
c) Photolithography
d) Etching and Bulk Micromachining
e) Metal deposition
f) Characterization Methods
g) BioMEMS Device Molding
h) Anodic bonding & MEMS Packaging (optional)