Electronic Packaging Substrate Fabrication

(1-0-6-3)

CMPE Degree: This course is Selected Elective for the CMPE degree.

EE Degree: This course is Selected Elective for the EE degree.

Lab Hours: 6 supervised lab hours and 0 unsupervised lab hours.

Technical Interest Groups / Course Categories: Threads / ECE Electives

Course Coordinator:

Prerequisites: (CHEM 1211K [min D] or CHEM 12X1 [min C] or CHEM 1310 [min D]) and PHYS 2212 [min D]

Catalog Description

Hands-on instruction in interconnect design, substrate material selection and properties, photodielectric deposition, via formation and photolithography, copper metallization, and substrate testing. Crosslisted with CHE 4755.

Textbook(s)

Fundamentals of Microsystems Packaging

Course Outcomes

Describe why and how devices and systems are packaged 

Design and Layout multilayer organic Substrate 

Explain role polymer materials as dielectrics and copper as conductors 

Perform Laser and photo processes for microvia formation in polymer dielectrics

Perform lithography process methods 

Describe microvia copper metallization by electroplating technologies

Analyze the role of passive components (capacitors, inductors and resistors) in circuits 

Perform inspection, metrology and substrate testing

Learn to operate tools and handle chemicals safely

Strategic Performance Indicators (SPIs)

N/A

Topic List

  1. Introduction to Packaging (including PRC SLIM)
  2. Lab Safety
  3. Interconnect Design
  4. Polymer Deposition
  5. Via Formation
  6. Metallization
  7. Substrate Testing