Electronics Packaging Assembly, Reliability, Thermal Management, and Test
(2-0-3-3)
CMPE Degree: This course is Selected Elective for the CMPE degree.
EE Degree: This course is Selected Elective for the EE degree.
Lab Hours: 3 supervised lab hours and 0 unsupervised lab hours.
Technical Interest Groups / Course Categories: Threads / ECE Electives
Course Coordinator:
Prerequisites: ECE 3030 [min C] or ECE 3040 [min C] or ECE 3710 [min D]
Catalog Description
The course provides hands-on instruction in electronics packaging, including assembly, reliability, thermal management, and test of next-generation microsystems. Crosslisted with ME and MSE 4754.Textbook(s)
Course Outcomes
Explain why and how any semiconductor device is packaged and assembled.
Explain interdisciplinarity of packaging involving electrical, mechanical, thermal, materials and processes.
Explain the role of interconnection and assembly materials to meet electrical, mechanical and thermal requirements.
Explain the need for thermal management and various heat transfer mechanisms.
Explain the need for modeling and experimental assessment of package reliability.
Explain the electrical failure mechanisms due to the fatigue behavior of metals or other material and interface degradation (polymer delamination, voiding, etc).
Explain characterization methods used in packaging to extract the physical properties of materials or monitor the package integrity.
Explain chemical safety in handling a variety of chemicals.
Strategic Performance Indicators (SPIs)
N/A
Topic List
- Introduction to System-On-Package
- Introduction to Packaging and Assembly and its interdisciplinarity
- Electrical
- Mechanical
- Thermal
- Materials
- Chemical processes
- Thermo-mechanical modeling and design for reliability of interconnections
- Flip-chip assembly materials and processes
- Heat transfer and thermal management
- Non-destructive inspection
- Failure analysis
- Laboratory safety