Sung Kyu Lim was born and grew up in Seoul, Korea, and moved to Los Angeles with his family at the age of 19. He received B.S. (1994), M.S. (1997), and Ph.D. (2000) degrees all from the Computer Science Department of University of California at Los Angeles (UCLA). During 2000-2001, he was a post-doctoral scholar at UCLA, and a senior engineer at Aplus Design Technologies, Inc.
In August 2001, he joined the School of Electrical and Computer Engineering at Georgia Institute of Technology an assistant professor. He is currently the director of the GTCAD (Georgia Tech Computer Aided Design) Laboratory at the School.
He recently released a CD with his rock band in Los Angeles and spends his leisure time writing/recording music.
- Physical design automation for VLSI circuits
- 3D circuit/packaging layout automation
- Quantum circuit layout automation
- Micro-architecture design space exploration
- Layout automation for reconfigurable circuits
- Graph theory and combinatorial optimization
- Advisory Board Member of ACM Special Interest Group on Design Automation (SIGDA) since 2003
- Technical Program Committee Member of ICCD, ISPD, ISCAS, ASPDAC, and GLSVLSI
- NSF CAREER Award, 2006
Peter Sassone and Sung Kyu Lim, "Traffic: A Novel Geometric Algorithm For Fast Wire-Optimized Floorplanning," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2006.
Eric Wong, Jacob Minz, and Sung Kyu Lim, "Multi-objective Module Placement For 3D System-On-Package," IEEE Transactions on Very Large Scale Integration Systems, 2006.
Mongkol Ekpanyapong, Jacob Minz, Thaisiri Watewai, Hsien-Hsin S. Lee, and Sung Kyu Lim, "Profile-Guided Microarchitectural Floorplanning for Deep Submicron Processor Design," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2006.
Jacob Minz, Eric Wong, Mohit Pathak, and Sung Kyu Lim, "Placement and Routing for 3D System-On-Package Designs," IEEE Transactions on Components and Packaging Technologies, 2006.
Jacob Minz and Sung Kyu Lim, "Block-level 3D Global Routing With an Application to 3D Packaging," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2006.
Sung Kyu Lim, "Physical Design for 3D System-On-Package: Challenges and Opportunities," IEEE Design & Test of Computers, Vol. 22, No. 6, pp. 532-539, 2005.
Sung Kyu Lim, Ramprasad Ravichandran, and Mike Niemier, "Partitioning and Placement for Buildable QCA Circuits," ACM Journal on Emerging Technologies in Computing Systems, Vol. 1, No. 1, pp. 50-72, 2005.
Last revised August 31, 2020