Thermal Engineering for Packaging of Micro and Nano Systems

(3-0-0-3)

CMPE Degree: This course is Not Applicable for the CMPE degree.

EE Degree: This course is Not Applicable for the EE degree.

Lab Hours: 0 supervised lab hours and 0 unsupervised lab hours.

Technical Interest Group(s) / Course Type(s): Courses for non-ECE majors, Nanotechnology

Course Coordinator:

Prerequisites: (ME 3322 and ME 3345) or ME 3720

Corequisites: None.

Catalog Description

Passive, active, and hybrid thermal management techniques, and computational modeling of micro systems. Air cooling, simlge phase and phase change liquid cooling, heat pipes, and thermoelectrics. Crosslisted with ME 6779.

Textbook(s)

Course Outcomes

Not Applicable

Student Outcomes

In the parentheses for each Student Outcome:
"P" for primary indicates the outcome is a major focus of the entire course.
“M” for moderate indicates the outcome is the focus of at least one component of the course, but not majority of course material.
“LN” for “little to none” indicates that the course does not contribute significantly to this outcome.

1. ( Not Applicable ) An ability to identify, formulate, and solve complex engineering problems by applying principles of engineering, science, and mathematics

2. ( Not Applicable ) An ability to apply engineering design to produce solutions that meet specified needs with consideration of public health, safety, and welfare, as well as global, cultural, social, environmental, and economic factors

3. ( Not Applicable ) An ability to communicate effectively with a range of audiences

4. ( Not Applicable ) An ability to recognize ethical and professional responsibilities in engineering situations and make informed judgments, which must consider the impact of engineering solutions in global, economic, environmental, and societal contexts

5. ( Not Applicable ) An ability to function effectively on a team whose members together provide leadership, create a collaborative and inclusive environment, establish goals, plan tasks, and meet objectives

6. ( Not Applicable ) An ability to develop and conduct appropriate experimentation, analyze and interpret data, and use engineering judgment to draw conclusions

7. ( Not Applicable ) An ability to acquire and apply new knowledge as needed, using appropriate learning strategies.

Strategic Performance Indicators (SPIs)

Not Applicable

Course Objectives

Topical Outline

1. Review of Heat Transfer
2. Introduction to Thermal Issues in Micro and Nano System Packaging
3. Thermal Characterization Through Analysis
4. Resistor Network Analysis
5. Conduction and Natural Convection from Printed Circuit Boards
6. Forced Convection Fundamentals and Application to Printed Circuit Boards
7. Design/Optimization of Single Fins and Heat Sinks
8. Thermal Issues in Data Centers
9. Introduction to Boiling and Condensation; Passive Immersion Cooling
10. Combined Mode Heat Transfer Modeling in Micro/Nano Systems
11. Passive Thermal Management
a. Heat Spreaders, Solid-Liquid Phase Change Materials
b. Solid-Liquid Phase Change Materials
c. Heat Pipes/Vapor Chambers
12. Microchannels
13. Active Thermal Management
a. Cold Plates
b. Thermoelectrics
c. Refrigeration
14. Thermal Interface Materials