Thermal Engineering for Packaging of Micro and Nano Systems
(3-0-0-3)
CMPE Degree: This course is Not Applicable for the CMPE degree.
EE Degree: This course is Not Applicable for the EE degree.
Lab Hours: 0 supervised lab hours and 0 unsupervised lab hours.
Technical Interest Group(s) / Course Type(s): Courses for non-ECE majors, Nanotechnology
Course Coordinator:
Prerequisites: (ME 3322 and ME 3345) or ME 3720
Catalog Description
Passive, active, and hybrid thermal management techniques, and computational modeling of micro systems. Air cooling, simlge phase and phase change liquid cooling, heat pipes, and thermoelectrics. Crosslisted with ME 6779.Textbook(s)
Course Outcomes
Not Applicable
Strategic Performance Indicators (SPIs)
Not Applicable
Topical Outline
1. Review of Heat Transfer
2. Introduction to Thermal Issues in Micro and Nano System Packaging
3. Thermal Characterization Through Analysis
4. Resistor Network Analysis
5. Conduction and Natural Convection from Printed Circuit Boards
6. Forced Convection Fundamentals and Application to Printed Circuit Boards
7. Design/Optimization of Single Fins and Heat Sinks
8. Thermal Issues in Data Centers
9. Introduction to Boiling and Condensation; Passive Immersion Cooling
10. Combined Mode Heat Transfer Modeling in Micro/Nano Systems
11. Passive Thermal Management
a. Heat Spreaders, Solid-Liquid Phase Change Materials
b. Solid-Liquid Phase Change Materials
c. Heat Pipes/Vapor Chambers
12. Microchannels
13. Active Thermal Management
a. Cold Plates
b. Thermoelectrics
c. Refrigeration
14. Thermal Interface Materials