Integrated and Low-Cost Microelectronics Systems Packaging
CMPE Degree: This course is Not Applicable for the CMPE degree.
EE Degree: This course is Not Applicable for the EE degree.
Lab Hours: 0 supervised lab hours and 0 unsupervised lab hours.
Course Coordinator: Muhannad S Bakir
Catalog DescriptionIntroduction to cross-disciplinary microelectronic packaging technologies, including electrical design, thermal considerations and technologies, reliability, optoelectronic packaging, and RF-/mm-wave packaging. Crosslisted with ME and MSE 6776.
Textbook(s)Fundamentals of Microsystems Packaging, System on Package (SOP): Miniaturization of the Entire System
Student OutcomesIn the parentheses for each Student Outcome:
"P" for primary indicates the outcome is a major focus of the entire course.
“M” for moderate indicates the outcome is the focus of at least one component of the course, but not majority of course material.
“LN” for “little to none” indicates that the course does not contribute significantly to this outcome.
1. ( Not Applicable ) An ability to identify, formulate, and solve complex engineering problems by applying principles of engineering, science, and mathematics
2. ( Not Applicable ) An ability to apply engineering design to produce solutions that meet specified needs with consideration of public health, safety, and welfare, as well as global, cultural, social, environmental, and economic factors
3. ( Not Applicable ) An ability to communicate effectively with a range of audiences
4. ( Not Applicable ) An ability to recognize ethical and professional responsibilities in engineering situations and make informed judgments, which must consider the impact of engineering solutions in global, economic, environmental, and societal contexts
5. ( Not Applicable ) An ability to function effectively on a team whose members together provide leadership, create a collaborative and inclusive environment, establish goals, plan tasks, and meet objectives
6. ( Not Applicable ) An ability to develop and conduct appropriate experimentation, analyze and interpret data, and use engineering judgment to draw conclusions
7. ( Not Applicable ) An ability to acquire and apply new knowledge as needed, using appropriate learning strategies.
Strategic Performance Indicators (SPIs)
Outcome 1 (Students will demonstrate expertise in a subfield of study chosen from the fields of electrical engineering or computer engineering):
1. Explain the different kind of electronic packages and their applications
2. Explain the benefits of emerging dense integration technologies
Outcome 2 (Students will demonstrate the ability to identify and formulate advanced problems and apply knowledge of mathematics and science to solve those problems):
1. Electrical modeling and assessment of interconnects networks commonly encountered at the package, including insertion loss and frequency dependent parasitics
2. Thermal modeling of electronic package assemblies, including calculating junction temperature.
Outcome 3 (Students will demonstrate the ability to utilize current knowledge, technology, or techniques within their chosen subfield):
1. Apply course knowledge to design modern electronic packages for digital and mm-wave applications
1. IC Evolution
2. Electronic Packaging and Design Considerations
a. Wirebond, TAB, flip-chip, and multi-chip modules
b. Signal distribution, power distribution, delta-I noise, mixed-signal design
c. Chip I/O structures, electrical performance, density, reliability considerations
3. Overview of Off-Chip Interconnects and their Evolution
a. Emergence of 2.5D and 3D IC technologies: attributes, performance, fabrication, and design considerations
4. Package Thermomechanical Design
a. Stress and warpage, material considerations, modeling
5. Electrical Test
a. Testing and test methods at IC packaging level, board level, and system level
6. Discrete and Integrated Components
a. Technologies and impact on electrical package design
7. Optoelectronic Integration
a. Motivation, packaging approaches and attributes, and challenges
8. RF/mm-wave Packaging:
a. Design consideration, packaging materials, processes, and integration
9. Thermal Management
a. Thermal IC power needs, cooling technologies, design consideration