Introduction to Electronic Systems Packaging

(3-0-0-3)

CMPE Degree: This course is Selected Elective for the CMPE degree.

EE Degree: This course is Selected Elective for the EE degree.

Lab Hours: 0 supervised lab hours and 0 unsupervised lab hours.

Technical Interest Groups / Course Categories: Threads / ECE Electives

Course Coordinator:

Prerequisites: ECE 3030 [min C] or ECE 3040 [min C] or ECE 3710 [min D]

Catalog Description

Introduction to packaging technologies, technology drivers, electrical performance, thermal management, materials, optoelectronics, RF integration, reliability, system issues, assembly, and testing.

Textbook(s)

Power Integrity Modeling and Design for Semiconductors and Systems, Circuits, Interconnections and Packaging of VLSI, Fundamentals of Microsystems Packaging, Design and Modeling for 3D ICs and Interposters, High Speed Signaling: Jitter Modeling, Analysis and Budgeting

Course Outcomes

Explain the difference between ICs and Packaging. 

Calculate the impact of scaling on MOS Transistors and interconnects. 

Calculate the capacitance, resistance and RC delays of interconnects.

Explain the fundamentals of packaging and different packaging technologies. 

Design and model transmission lines in package substrates (PCB).

Design H-Tree clock distribution networks. 

Explain the importance of power delivery networks for high speed signaling.

Design and model power delivery networks on PCB. 

Explain the role of thermal management in high speed systems.

Calculate thermal resistances for a system and resulting junction temperature for transistors. 

Design a PCB with ICs for high speed signaling that includes power delivery and make signaling and power supply noise measurements.

Strategic Performance Indicators (SPIs)

N/A

Topic List

  1. Introduction
  2. ICs and Electronic Packaging
  3. Microsystems Integration
  4. Basics of High Speed Signaling
  5. Logic to Memory Communication
  6. Chip to Chip Communication
  7. Devices & Interconnects
  8. Device and Interconnect Scaling
  9. Interconnect Capacitance
  10. Interconnect Resistance & RC Delays
  11. Packaging & Signal Transmission
  12. Fundamentals of Packaging
  13. Signal Transmission
  14. Transmission Lines and Matching
  15. Clock Distribution Basics
  16. Clock Distribution Design
  17. Crosstalk
  18. Channel Modeling & Design
  19. Eye Diagrams & Jitter
  20. Power Delivery
  21. Power Delivery Engineering
  22. Power Distribution Basics and Simple Relationships
  23. Concept of Target Impedance
  24. Power Distribution Components: Switching Regulators
  25. Power Distribution Components: Capacitors
  26. Power Distribution Components: Planes
  27. Power Distribution Components: Low Drop-Out Regulator
  28. Impedance calculations
  29. Impedance and Simultaneous Switching Noise
  30. Signaling and Power Supply Noise
  31. Current Flow Paths & Simultaneous Switching Noise
  32. Thermal Management
  33. Conduction, Convection & Radiation
  34. Thermal Materials
  35. Thermal Calculations
  36. Emerging Technologies