The 75th IEEE Electronic Components and Technology Conference (ECTC) will be buzzing with researchers from Georgia Tech.
The premier international microelectronic systems science and technology event features work and leadership from the School of Electrical and Computer Engineering (ECE), the George W. Woodruff School of Mechanical Engineering, and the School of Materials Science and Engineering (MSE). It will be highlighted by two ECE students who are receiving prestigious awards for their research.
Third-year Ph.D. student Srujan Penta will accept the IEEE ECTC Intel Outstanding Student Paper Award from last year’s conference.
His paper, "Performance Evaluation of UCIe-based Die-to-Die Interface on Low-Cost 2D Packaging Technology,” demonstrated a cheaper and efficient way to package chips using a standard 2D design, instead of more costly complex methods, while maintaining good power usage and space efficiency.
He co-authored the paper with ECE Ph.D. student Zhonghao Zhang and his advisor, ECE Professor Muhannad S. Bakir, along with a team from Marvell Technology, Inc comprising of Ting Zheng, Eric Tremble, Aatreya Chakravarti, Anthony Sigler, Carl Benes, and Wolfgang Sauter.
Fifth-year Ph.D. candidate Shane Oh will also be honored at ECTC, receiving the IEEE Transactions on Components, Packaging and Manufacturing Technology Best Paper Award in the Advanced Packaging Technologies category for his paper, “Heterogeneous Integration Enabled by 3-D Stitch-Chips.”
Bakir, his Ph.D. advisor, coauthored the paper, along with Ph.D. students Zhonghao Zhang and Geyu Yan, and senior research engineer Paul K. Jo from the Georgia Tech Research Institute.
The work introduced a new interconnect technology called the 3D Stitch-Chip (3DSC), which offers a novel solution to the limitations of traditional interconnection methods such as wire bonding, die-embedding, and flip-chip bonding.
Five other students from ECE research groups will present their research over the course of several technical sessions at ECTC.
Four come from Bakir’s Integrated 3D Systems Lab:
Computer Science Ph.D. student Euichul Chung will give the talk, “Thermal Management of Heterogeneously Integrated HBM-GPU Module with Step Height Difference,” which explores various system-level thermal management of heterogeneous HBM-GPU package with multi-die configurations.
ECE Ph.D. student Hyunggyu Park will present his poster “Ultra-Thin Chiplet Embedding in Glass-Core Package Redistribution Layers.” The work proposes embedding ultra-thin chiplets in glass-core package redistribution layers at a package level heterogeneous integration to maximize package density while utilizing massive footprint scale-out of glass substrates.
Third-year Ph.D. student Srujan Penta will accept the IEEE ECTC Intel Outstanding Student Paper Award from last year’s conference.
Fifth-year Ph.D. candidate Shane Oh will receive the IEEE Transactions on Components, Packaging and Manufacturing Technology Best Paper Award.
ECE Ph.D. student Zhonghao Zhang will present his research, “High-Frequency Multi-Chip RF Module Enabled by Fused-Silica Stitch-Chip Technology: RF and Interconnect Characterization,” which presents a fused-silica stitch-chip interconnect incorporating compressible microinterconnects (CMIs) that accommodate chiplet height variation.
ECE Ph.D. student Ashita Victor will present her poster “SiO2-based Chiplet Reconstitution Technology for Multi-Height Chiplet Integration.” The research aims to enable high-density heterogeneous integration and increased interconnection density using wafer-scale packaging techniques.
The fifth presenter, ECE Ph.D. student Chenhao Hu, comes from professor Manos Tentzeris’s ATHENA Lab.
He will present his work, “Thermal Characterization and Benchmarking of Aluminum Ribbon Ceramic (ARC) Substrates in mmWave/RF Packaging Applications.”
Additional research presentations come from the Schools of Mechanical Engineering and Materials Science and Engineering:
- Embedded Silicon Chip Capacitors in Glass Package for Vertical Power Delivery
- Ramin Rahimzadeh Khorasani, Mohammad Al-Juwhari, Madhavan Swaminathan – Pennsylvania State University; Xingchen Li – Georgia Institute of Technology
- Novel Fabrication of Alumina Nanowires and Their Integration Into Alumina Nanowire, Membranes and Aerogels-Epoxy Composites for Enhanced Thermal Management in 2.5D/3D Semiconductor Packaging
- Zihao Lin, Wenbin Fu, Kyoung-Sik Moon, C. P. Wong – Georgia Institute of Technology
- Study on Board-Level Reliability of 100x100 mm2 Large Glass Packages: Warpage, Thermo-Mechanical Reliability, and Parameter Envelope for High-Performance Computing Applications
- YongWon Lee, Kaushik Godbole, Suresh K. Sitaraman, Hyunggyu Park, Kyoung-Sik Moon, Muhannad Bakir – Georgia Institute of Technology
- 3D Vertical Glass Stacking for 6G Communications – Interconnect Fabrication and Broadband Characterization
- Xingchen Li, Lakshmi Narasimha Vijay Kumar – Georgia Institute of Technology; Madhavan Swaminathan – Pennsylvania State University
- Multi-Layer Sequential Fabrication and Mechanics-Based Model of Glass-Core Packages With Embedded Dies
- Alexander King, Kyoung-Sik Moon, Mohan Kathaperumal, Muhannad Bakir, Suresh K. Sitaraman – Georgia Institute of Technology
- Rapid Dendritic Amplification of Amino Groups on BN Surfaces for Enhanced Thermal Conductivity in Polymer Composites
- Zihao Lin, Juwon Lim, Yu-Chieh Lin, Kyoung-Sik Moon, C. P. Wong – Georgia Institute of Technology
- Organic and Hybrid Nanoscale Films for Low Loss Direct Glass-Copper Metallization
- Sai Saravanan Ambi Venkataramanan, Hyunggyu Park, Lakshmi Narasimha Vijay Kumar, Lila Dahal, Mohan Kathaperumal, Mark Losego – Georgia Institute of Technology
Manos Tentzeris is serving on the Electrical Design & Analysis technical committee.
Mechanical Engineering Professor Suresh Sitaraman is serving on on the Thermal/Mechanical Simulation and Characterization committee.
Mechanical Engineering Associate Professor W. Hong Yeo is serving on the Emerging Technologies committees respectively.
Georgia Tech faculty members are also serving in several leadership roles at the conference.
Tentzeris is on the Electrical Design & Analysis technical committee. Mechanical Engineering Professor Suresh Sitaraman and Associate Professor W. Hong Yeo are on the Thermal/Mechanical Simulation and Characterization, and Emerging Technologies committees respectively.
The conference is being held in Dallas, Texas from May 27 – 30. For information on the 75th ECTC, click here.
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Penta Wins Intel Outstanding Student Paper Award for Cost-Efficient Chiplet Systems in 2D Packaging
The research is aimed to bridge the gaps in understanding chiplet-based systems.
Oh Wins IEEE Transactions on Components, Packaging and Manufacturing Technology Best Paper Award
The research, which introduces a novel chip interconnect technology, is an important step toward more flexible multichip modules and advanced glass-based packaging platforms.