The Georgia Tech School of Electrical and Computer Engineering (ECE) is introducing the GlobalFoundries Termed Chair in Packaging and 3D Heterogeneous Integration.

The prestigious position will be awarded to a distinguished faculty member who has demonstrated excellence in research and teaching in the areas of chiplet-based integrated circuit (IC) systems, 2.5D, and 3D IC technologies.

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, headquartered in Malta, New York, providing a wide range of wafer fabrication services and differentiated technologies for automotive, smart mobile devices, internet of things, communications infrastructure, aerospace and defense, and other high-growth markets.

"We are incredibly excited about this opportunity to deepen our relationship with GlobalFoundries,” said Arijit Raychowdhury, professor and Steve W. Chaddick School Chair in ECE. “We are grateful to all involved at GlobalFoundries for giving us an opportunity to further strengthen the School’s reputation and pioneering work in advanced packaging. It is a significant testament to collaboration and innovation in this critical field."

3D heterogeneous integration (3DHI) is a cutting-edge technology that merges various ICs and components, including processors, memory, sensors, and RF modules, into one 3D package.

The holder of the GlobalFoundries Termed Chair in Packaging and 3DHI will be a faculty member with:

• Expertise in power delivery in advanced packaging, including the impact of 3D stack, bridge-chip, and decap location.
• Proficiency in fabrication and electrical design for 2.5D or 3D systems.
• The ability to teach both graduate and undergraduate classes in packaging and heterogeneous integration.

GF’s sponsorship of the termed chair also supports the development of additional curriculum in 3DHI and packaging.

The announcement builds upon a strategic agreement between Georgia Tech and GF announced in 2023. The agreement outlined a framework of collaboration to expand research and development opportunities based on GF semiconductor technology, curriculum development, training programs, internships, and joint faculty/engineering exchanges.