Thursday, April 23, 2026 01:00PM
Title: Electrical-thermal Co-design and System-level Analysis of Advanced Packaging Solutions for Hardware Accelerators and Sensor Technologies
Committee:
Dr. Shimeng Yu, ECE, Chair, Advisor
Dr. Muhannad Bakir, ECE
Dr. Saibal Mukhopadhyay, ECE
Dr. Tushar Krishna, ECE
Dr. Yingyang (Celine) Lin, CoC