Monday, November 04, 2024 12:30PM
Title: HI Design and Simulation Processes Utilizing Siemens Digital Twin Technology
Date: Monday, November 4, 2024
Time: 12:30 p.m.-1:20 p.m.
Location: Van Leer Building, C240
Abstract: Overview of the tools and processes for Heterogeneous Integration (HI) design and simulation using Siemens digital twin tools and processes with added information on IC packaging.
Bio: Over three decades in the Electronics industry, designing a wide range of products, SME in IC packaging and HI, design processes and tools, Father of 5, avid hiker, runner and cyclist.