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ECE Course Syllabus

ECE6422 Course Syllabus


Interface IC Design for MEMS and Sensors (3-0-0-3)

Lab Hours
0 supervised lab hours and 0 unsupervised lab hours

Technical Interest
Electronic Design and Applications

Course Coordinator

ECE 4430


Catalog Description
Design of low-noise interface circuits for sensors and micromechanical devices (MEMS). Design of integrated microsystems.

Gray, Hurst, Lewis, & Meyer, Analysis and Design of Analog Integrated Circuits (4th edition), Wiley, 2009. ISBN 9780471321682 (required)

Razavi, Design of Analog CMOS Integrated Circuits, 2017. (required)

Indicators (SPIs)
SPIs are a subset of the abilities a student will be able to demonstrate upon successfully completing the course.

Outcome 1 (Students will demonstrate expertise in a subfield of study chosen from the fields of electrical engineering or computer engineering):
1.	Understand integrated transducers and electromechanical mechanisms for sensing and actuation
2.	Understand sensor interface circuits and signal conditioning architectures and tradeoffs between system parameters

Outcome 2 (Students will demonstrate the ability to identify and formulate advanced problems and apply knowledge of mathematics and science to solve those problems):
1.	Analyze various noise sources and determine the input referred noise in sensor interfaces 
2.	Analyze capacitance-to-voltage convertor circuits and trans-impedance amplifiers in sensor interfaces and MEMS crystal oscillators

Outcome 3 (Students will demonstrate the ability to utilize current knowledge, technology, or techniques within their chosen subfield):
1.	Design interface circuits for any sensor or micromechanical device and demonstrate their intended operation and performance through analysis and simulation.

Topical Outline
1. Integrated Sensors and Actuators: An Overview
   a. MEMS: microsensors, microactuators, frequency references, energy harvesters
   b. Integrated sensors and actuators (CMOS-based and MEMS-based)
   c. MEMS-CMOS processes
   d. Overview of micromachining and microfabrication techniques
2. Transducers and Micro-Electro-Mechanical-System (MEMS) Devices
   a. Sensor specifications
   b. Micro-electro-mechanical-system (MEMS) sensor design and modeling
   c. MEMS accelerometers
   d. Integrated signal transduction mechanism and modeling
   e. Image sensors
   f. Electrophoresis, electrochemical sensors
   g. Sensor noise sources, electro-mechanical mechanisms, and modeling: Brownian noise, pull-in voltage, comb-drives, electrostatic stiffness, nonlinearities, etc.
   h. Electrical modeling of resonators and micromechanical devices
   i. MEMS resonators, Quality factor (Q)
   j. MEMS Coriolis gyroscopes
3. Interface Circuits for MEMS and Sensors
   a. Fundamentals of noise in ICs
   b. Continuous and sampled-data systems
   c. Switched capacitor charge amplifiers and integrators
   d. Capacitive AC bridges
   e. Dynamic noise and offset cancellation techniques: Chopping, Auto-Zeroing, CDS
   f. Dynamic element matching
   g. Fully-differential op-amps
   h. Low noise op-amps and trans-impedance amplifiers (TIA)
   i. Distortion analysis
   j. Effect of feedback on noise and distortion
   k. Charge pumps
   l. Bandgap reference, supply independent biasing
   m. Overview of data converters
4. MEMS Oscillators
   a. MEMS acoustic resonators, flexural and bulk acoustic wave resonators, modeling
   b. Oscillator design principles (Relaxation, LC, Micromechanical Resonator based)
   c. Trans-impedance amplifier (TIA) design
   d. MEMS oscillator design using TIA
   e. Open-loop and feedback TIA
   f. Phase noise in oscillators
   g. Automatic level control in oscillators, controlling amplitude & phase in MEMS oscillators
   h. Frequency tuning
   i. Allan variance analysis