Jun 04, 2014 - Atlanta, GA
Madhavan Swaminathan received the 2014 IEEE Components, Packaging, and Manufacturing Technology Society Outstanding Sustained Technical Contribution Award on May 29 at the IEEE Electronic Components Technology Conference, held in Lake Buena Vista, Florida.
Swaminathan was honored "for significant and sustained contributions that have helped shape the design aspects of packaging in the areas of power delivery, system on package technologies, and 3D integration."
A faculty member in the Georgia Tech School of Electrical and Computer Engineering since 1994, Swaminathan holds the John Pippin Chair in Electromagnetics, and he is the director of the Interconnect and Packaging Center. He previously served as the deputy director of the Microsystems Packaging Research Center from 2004-2008.
Swaminathan leads the Mixed Signal Design Group in ECE, where he and his team conduct research in computational electromagnetics, multi-physics modeling, computer-aided design, 3D integration, nano materials, microwave design, RF sensors, and high-speed signaling.
He has published more than 400 technical articles, holds 27 issued patents, and is the author and co-editor of three books, all related to electronic packaging. He is the co-founder and founder, respectively, of two spin-off companies, Jacket Micro Devices and E-System Design.