2019 News

Handbook of 3D Integration Published

Handbook of 3D Integration was published in March 2019. 

Spring 2019 Capstone Expo Brings New Ideas and Innovation

236 teams from 11 different schools and programs and three colleges competed in the Spring 2019 Capstone Design Expo at McCamish Pavilion.

Devleena Das

Das Honored with Helen Grenga Outstanding Woman Engineer Award

Devleena Das was presented with the Helen Grenga Outstanding Woman Engineer Award at the 2019 Women in Engineering Awards Banquet, held on April 11 at the Georgia Tech Hotel and Conference Center.

Francesco Amato

Amato Honored with Clive Hohberger Technology Award

ECE Ph.D. alumnus Francesco Amato, currently at the University of Rome, was named the recipient of the inaugural Clive Hohberger Technology Award by the Advancing Identification Matters (AIM) industry organization.

Cheng Qi

Qi Chosen for IEEE RFID 2019 Best Paper Award

ECE Ph.D. student Cheng Qi won the Best Paper Award at the IEEE International Conference on RFID 2019.

In Loving Memory of Sudhakar Yalamanchili

The School of Electrical and Computer Engineering (ECE) at Georgia Tech will hold a memorial service honoring our beloved friend and colleague, Sudhakar Yalamanchili, on Wednesday, May 1 at 2 pm in the Klaus Advanced Computing Building, Room 1116 E/W.

Razi Dehghannasiri 

Two ECE Graduates Win Sigma Xi Best Ph.D. Thesis Awards

Recent ECE Ph.D. graduates Razi Dehghannasiri and Sean Rodrigues have been chosen for Georgia Tech Sigma Xi Best Ph.D. Thesis Awards. 

Zajic Selected for IEEE Atlanta Section Outstanding Engineer Award

ECE Associate Professor Alenka Zajic has been selected for the IEEE Atlanta Section Outstanding Engineer Award.

Marilyn Wolf

Wolf Named Recipient of IEEE Computer Society 2019 Harry H. Goode Memorial Award

Marilyn Wolf has been selected to receive the IEEE Computer Society 2019 Harry H. Goode Award.

John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the Center for Co-Design of Chip, Package, System (C3PS), Georgia Tech.

Swaminathan Appointed as PRC Director

Following an international search, Madhavan Swaminathan has been appointed as the new director of Georgia Tech’s 3D Systems Packaging Research Center (PRC).

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